IEC 60191-6-4 Ed. 1.0 en:2003, Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings … methods for package dimensions of ball grid a by IEC TC/SC 47D


IEC 60191-6-4 Ed. 1.0 en:2003, Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings ... methods for package dimensions of ball grid a by IEC TC/SC 47D

Download IEC 60191-6-4 Ed. 1.0 en:2003, Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings ... methods for package dimensions of ball grid a ebook by IEC TC/SC 47D

Type: pdf, ePub, zip, txt
Publisher: Multiple. Distributed through American National Standards Insti
Released: August 19, 2007
Page Count: 24
Language: English

Download link: IEC 60191-6-4 Ed. 1.0 en:2003, Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings ... methods for package dimensions of ball grid a

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Covers the requirements for the measuring methods of ball grid array (BGA) dimensions. This title may contain less than 24 pages of technical content.... read more ...











 
 
 
 
 
 



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